Long-Pot-Life, High-Modulus, Non-Sag, Structural Epoxy Adhesive
Planibond Hi-Mod Gel LPL is a high-modulus, high-strength, moisture-tolerant, zero-VOC, two-part, non-sag, structural epoxy adhesive designed for a wide variety of bonding and repair applications, while providing a long pot life and open time.
Product catalogs
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Technical Data Sheet
