Planibond Hi-Mod Gel

High-Modulus, Non-Sag, Structural Epoxy Adhesive

Planibond Hi-Mod Gel is a high-modulus, high-strength, moisture-tolerant, low-VOC, two-part, non-sag, structural epoxy adhesive designed for a wide variety of bonding and repair applications.

Related documentation

Technical Data Sheet
Download
Safety Data Sheet
Download
Specifications
Download
Sustainability Product Report
Download
Volatile Organic Compound
Download

Product documentation

Planibond Hi-Mod Gel is part of the lines:

Keep in touch

Subscribe to our newsletter to get Mapei news